王波

  2026-03-03   点击：[197]

  1. Wang B, Ke Z L, Chen Z M, Li W Y, Huang W, He S L, Pan K L, Nishikawa H. Size effect on shear performance of microscale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints under current stressing. Soldering & Surface Mount Technology, 2026, 38(2): 156‒172. (JCR2区)

  2. Wang B, He S L, Zhang G P, Liu M H, He K X, Huang W, Pan K L. Study on Microstructure and Properties of Micron Copper Powder-Liquid Metal Gallium Composite Interconnect Joint. Materials, 2026, 19: 314. (JCR1区)

  3. Wang B, Zhu P Y, Zhang G P, Deng C Y, He K X, Huang W, Pan K L. Study on the IMC growth mechanism of Cu/Sn-58Bi/Cu joint under electromigration with alternating current. Crystals, 2026, 16: 127. (JCR2区)

  4. Wang B, Ke Z L, Ran G L, Huang W, Pan K L. Study on Shear Performance and Fracture Behaviour of Cu-Sn Intermetallic Compound Joints Under Electro-mechanical Coupled Loads. 10th International Conference on The Asia International Symposium on Mechatronics (AISM), 2026, pp. 1‒13. (EI收录)

  5. Zhang Y L, Wang B(通讯), Rang G L, Huang W, Pan K L. Growth Kinetics and Shear Reliability of Cu-Sn IMC Joints. 10th International Conference on The Asia International Symposium on Mechatronics (AISM), 2026, pp. 1‒17. (EI收录)

  6. Ke S, Wang B(通讯), Liu G G, Huang W, Gong Y B, Pan K L. DFT study of free radical scavenging mechanisms in UiO-66-(OH)₂ and UiO-66-NH₂ MOFs. RSC advance, 2025, 15: 20220‒20232. (JCR1区)

  7. Ke S, Luo C, He S L, Wang B(通讯), Huang W, Nishikawa H, Pan K L. Interfacial strengthening of epoxy composites by functionalized UiO-66 MOFs under thermal cycling. Journal of Electronic Materials, 2025, 55: 1607‒1625. (JCR2区)

  8. Pan K L, Chen Z M, Liu M H, Ke Z L, Wang B(通讯), He K X, Huang W, He S L. Effect of Current Density on Shear Performance and Fracture Behavior of Cu/Sn-58Bi/Cu Solder Joints. Crystals, 2025, 15: 945. (JCR2区)

  9. 王波，冉光龙，刘明，何凯旋，张坚，黄伟，潘开林．Cu3Sn相厚度对Cu-Sn IMC接头剪切性能的影响研究．电子机械工程（青年学者论坛），2025，41(5)：40‒46．

  10. 冉光龙，王波（通讯），黄伟，龚雨兵，潘开林．IMC厚度对混装焊点热疲劳寿命的影响研究．电子与封装，2025，25(1)：010203．

  11. 陈柏雨，王波，可帅，黄伟，刘岗岗，潘开林．金-铝键合界面空洞生长动力学研究．半导体技术，2025，50(06)：633‒640．

  12. Wang B, Li W Y, Pan K L, Huang W, Gong Y B. Size dependence on shear fatigue and fracture behavior of ball grid array structure Cu/Sn‒3.0Ag‒0.5Cu/Cu solder joints under current stressing. Frontiers in Materials, 2024, 11: 1452773. (JCR2区)

  13. Liu M H, Zhu P Y, Ran G L, Wang B(通讯), Huang W, Gong Y B, Wei S, Pan K L. Influence of Cu9Ga4 growth on Shear Behavior of Cu-Ga Full IMC Joint. In proceedings of 25th International Conference on Electronic Packaging Technology, 2024, pp. 1‒5. (EI收录)

  14. Zhu P Y, Liu M H, Ran G L, Wang B(通讯), Huang W, Gong Y B, Pan K L. Abnormal Electromigration Behavior of Sn-58Bi Solder Joints under Alternating Current Stressing. In proceedings of 25th International Conference on Electronic Packaging Technology, 2024,  pp. 1‒5. (EI收录)

  15. Wang B, Li W Y, Zhang S Y, Li X M, Pan K L. Effect of electric current stressing on mechanical performance of solders and solder joints: A review. Journal of Materials Science, 2022, 57: 17533–17562. (JCR1区)

  16. Wang B, Li W Y, Pan K L. Shear performance of microscale ball grid array structure Sn‒3.0Ag‒0.5Cu solder joints with different surface finish combinations under electro‒thermo‒mechanical coupled loads. Journal of Materials Science: Materials in Electronics, 2022, 33(8): 4924–4939. (JCR2区)

  17. Wang B, Li W Y, Pan K L. Abnormal shear performance of microscale ball grid array structure Cu/Sn‒3.0Ag‒0.5Cu/Cu solder joints with increasing current density. Crystals, 2022, 12: 85. (JCR2区)

  18. Wang B, Li W Y, Huang W, Gong Y B, Xu J, Pan K L. The breakdown of Anand constitutive model in life prediction of microscale BGA structure Sn–3.0Ag–0.5Cu joints stressed with electric current. In proceedings of 23th International Conference on Electronic Packaging Technology, 2022, pp. 1–6. (EI收录)

  19. Liu L G, Wang B, Li W Y, Gong Y B, Pan K L. Fatigue performance of Cu/Sn–3.0Ag–0.5Cu/Cu solder joints at different current densities. In proceedings of 24th Electronics Packaging Technology Conference (EPTC), 2022, pp. 791‒794. (EI收录)

  20. Huang W, Pan K L, Wang B, Gong Y B. Grain size effects on mechanical properties of nanocrystalline Cu6Sn5 investigated using molecular dynamics simulation. Materials, 2022, 15: 3889. (JCR2区)

  21. Wang B, Pan K L, Gong Y B, Long Y H, Shi K. Effect of ultrasonic power on wettability, porosity and mechanical properties of ultrasonic‒aided laser reflow soldering. International Journal of Modern Physics B, 2021, 35: 2150063. (JCR2区)

  22. Liu H L, Huang Y P, Wang B, Wang X Y. Study on the process optimization and wear resistance of electron beam cladding WC‒CoCr coating on Inconel617 surface. Advance in Materials Science and Engineering, 2019, 10: 1‒10. (JCR 4区)

  23. 刘海浪，王小宇，王波，祁正伟，张国培．电子束加工应力场的研究现状与发展趋势．热加工工艺，2019，48：21‒25．

  24. 黄以平，张国培，刘海浪，王波，蒋健博．Inconel617合金表面电子束熔覆NbMoCr显微组织和耐腐蚀性的探讨[J]．焊接学报，2019，40：101‒106．（EI）

  25. Liu H L, Wang B(通讯), Qi Z W, Zhang G P, Wang D Z. Surface microstructure and anti‒wear of WC‒CoCr coatings cladded by electron beam. Rare Metal Materials and Engineering, 2018, 47: 3338‒3344. (JCR4区)

  26. Liu H L, Qi Z W, Wang B, Zhang G P, Wang X Y, Wang D Z. Numerical simulation of temperature field during electron beam cladding for NbSi2 on the surface of Inconel617. Materials Research Express, 2018, 5: 036528. (JCR3区)

  27. 王波，刘海浪，祁正伟，张国培，王小宇．电子束熔覆表面改性技术的研究进展[J]．热加工工艺，2018，47：19‒22．（中文核心）

  28. 刘海浪，王波，李行，黄以平．Inconel617合金表面电子束熔覆WC‒CoCr显微组织和耐磨性研究[J]．航空制造技术，2017，21：102‒104，109．（中文核心）



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