位松

期刊论文

1. Z Wu, W Wang, D Bao, S Wei*, R Li, J Guo. Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays. Applied Thermal Engineering, 2025, 263(15): 125258.

2.  F Chen, L Mo, F Hu, W Li, S Wei*. Synergistic effect of thermomigration and electric current stressing on damping capacity of Sn58Bi solder. Vacuum, 2025, 231: 113760. 

3. S Chen, R Li, H Hu, J Guo, S Wei*, W Li. Improving the thermal, mechanical, and insulating characteristics of thermal interface materials with liquid metal‑based diphase structure. Journal of Materials Science. 2024, 59: 19125. 

4. Z Zheng, S Wei*, Y Yang, D Zhang, D Yang, W Li, J Guo. Low-temperature solidifiable liquid metal with ultrahigh thermal conductivity enabled by spontaneous phase transition for electronics' safety and long-life cooling. Advanced Engineering Materials, 2023, 25(11): 2201817.

5. S Wei, W Wang, L Zhou, J Guo. Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal. Composites Part A - Applied Science and Manufacturing, 2022, 162: 107149. 

6. X Li, J Wang, H Qin, S He, W Li, S Wei*. Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density. Journal of Materials Science: Materials in Electronics, 2022, 33: 16167. 

7.  周丽君, 位松, 郭敬东, 孙方远, 王新伟, 唐大伟. 基于飞秒激光时域热反射法的微尺度 Cu-Sn 金属间化合物热导率研究 [J]. 金属学报, 2022, 58(12): 1645.

8.  S Wei, Z Yu, L Zhou, J Guo. Investigation on enhancing the thermal conductance of gallium-based thermal interface material using Cr-coated diamond particles. Journal of Materials Science: Materials in Electronics, 2019, 30: 7194.

9. Z Yu, S Wei, J Guo. Fabrication of aligned carbon-fiber/polymer TIMs using electrostatic flocking method. Journal of Materials Science: Materials in Electronics, 2019, 30: 10233. 

10. J Chen, J Guo, H Ma, S Wei. J.K. Shang. Cu₆Sn₅ intermetallic compound anisotropy introduced by single crystal Sn under current stress, Journal of Alloys and Compounds, 2017, 695(695): 3290. 

11. S Wei, H Ma, J Chen, J Guo. Extreme anisotropy of electromigration: Nickel in single-crystal tin. Journal of Alloys and Compounds, 2016, 687: 999-1003. 

12. 位松, 尹立孟, 许章亮, 李欣霖. 锡基钎料与铜界面IMC的研究进展, 电子元件与材料, 2012, 31(1): 73-77. 

13. 
    

会议论文

1. Lu P, Deng J, Qiu X, Wei S*. High-frequency characterization of space vector pulse-width modulated SiC MOSFET three-phase inverters. In2024 7th International Conference on Energy, Electrical and Power Engineering (CEEPE) 2024 Apr 26 (pp. 242-247).

2. Chen H, Qiu X, Lu P, Wei S, Li R. Stacked circuit packaging method of multichip SiC MOSFET power modules for electrical performance improvement. In2023 24th International Conference on Electronic Packaging Technology (ICEPT) 2023 Aug 8 (pp. 1-5).

3. Yun M, Zhang K, Cai M, Yang Y, Feng C, Wei S*, Yang D, Zhang G. Extraction, optimization and failure detection application of parasitic inductance for high-frequency SiC power devices. In2021 22nd International Conference on Electronic Packaging Technology (ICEPT) 2021 Sep 14 (pp. 1-5).

4. Wei S*, Zhou LJ, Guo JD. Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy. In2018 19th International Conference on Electronic Packaging Technology (ICEPT) 2018 Aug 8 (pp. 1333-1336).