何思亮

2025年

1. H. Zhang, X. Li, S. He*, W. Guo*, Y. Cao* and H. Nishikawa, Interfacial characteristic and bonding mechanism of Ag nanoparticles on ENIG surface, in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2025.3648661.（SCI）

2. Siliang He, Xiangdong Liu, Zhiliang Pan, Sheng Gao, Yang Zuo, Hiroshi Nishikawa, Tailored microstructure and enhanced bonding strength of in-situ surface modified Cu flakes via oxidation–reduction bonding, Materials & Design, Volume 254, 2025,114048.(SCI, 中科院二区)

3. Xiong, B., Luo, C., Li, X. Hu,L. He,S.*et al. Cu/Sn-58Bi/Microporous-Cu Composite Joint Formation via Capillary-Driven Transient Liquid-Phase Bonding Under Air Atmosphere. J. Electron. Mater. (2025).(SCI) 

4. Pan, K.; Chen, Z.; Liu, M.;Ke, Z.; Wang, B.*; He, K.; Huang, W.;He, S*. Effect of Current Density onShear Performance and FractureShear Performance and FractureBehavior of Cu/Sn-58Bi/Cu SolderJoints. Crystals 2025, 15, 945. (SCI)

   2024年

1. Guanda Qu, Wei Guo, Cheng Zhang, Junliang Xue, Zilong Peng, Changhao Yin, Siliang He*, Guisheng Zou, Qiang Jia, Hongqiang Zhang*，“Improving thermal stability and reliability of power chips by sintering foam structure layer”，Applied Materials Today, vol. 40, pp. 102397, 2024(SCI, 中科院二区)

2. Wangyun Li, Lanqing Mo, Feng Chen, Zongbei Dai, Yiqin Xu, Siliang He*, Hiroshi Nishikawa*, “Counter-intuitive mechanical performance variation in aged low-temperature interconnections in electronic packaging”, Vaccum, vol. 227, pp. 113367, 2024(SCI, 中科院二区)

3. Zhang Hongqiang, He Siliang*, Qu Guanda, Deng Zhongyang, Zou Guisheng, Jia Qiang*, Deng Erping*, Guo Wei, “Improved thermal conductivity and reliability through graphene reinforced nanopaste for power devices in new energy vehicles”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 1, pp. 52-60, 2024（SCI, ）

4. Xiong Bifu, He Siliang*, Ge Jinguo, Li Quantong, Hu Chuan, Yan Haidong, Shen Yu-An*, “Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere”, Soldering & Surface Mount Technology, Vol. 36 No. 1, pp. 39-50, 2024(SCI, 中科院二区)

5. Siliang He, Jian Jiang, Yu-An Shen, Lanqing Mo, Yuhao Bi, Junke Wu, Chan Guo*, “Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature”, Materials, 2024(SCI,)

   2023年

1. Li Wangyun*, Mo Lanqing, Li Xingmin, Wang Jian, Qin Hongbo, He Siliang*,“Minor Ag induced shear performance alternation in BGA structure Cu/SnBi/Cu solder joints under electric current stressing”,Journal of Materials Research and Technology, Vol. 25, pp. 6111-6122, 2023(SCI, 中科院一区TOP)

2. He, Siliang; Xiong, Bifu; Xu, Fangyi; Chen, Biyang; Cui, Yinhua; Hu, Chuan; Yue, Gao*; Shen, Yu-An*, “Low-Temperature Transient Liquid Phase Bonding Technology via CuPorous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere”，Materials, 2023(SCI,) 

   2022年

1. He Siliang*, Shen Yu-An, Xiong Bifu, Huo Fupeng, Li Jiahui, Ge Jinguo, Pan Zhiliang, Li Wangyun, Hu Chuan, Nishikawa Hiroshi, “Behavior of Sn-3.0Ag-0.5Cusolder/Cu fluxless soldering via Sn steaming under formic acid atmosphere”,Journal of Materials Research and Technology, Vol. 21, pp. 2352-2361, 2022(SCI, 中科院二区)

2. Siliang He*, Yuhao Bi, Yu-An Shen, Zhikuan Chen, Gao Yue*, Chuan Hu, and Hiroshi Nishikawa. Contact Angle Analysis and Intermetallic Compounds Formation Between Solders and Substrates under Formic acid Atmosphere. Journal of Advanced Joining Process.（2022）, 6, 100118.（ESCI,中科院二区）

3. Peijie Liang, Zhiliang Pan, Liang Tang, Guoqi Zhang, Daoguo Yang, Siliang He*, and Haidong Yan*. Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer. Materials.2022, 15, 2232.（SCI）

4. Minghui Yun, Daoguo Yang*, Siliang He*, Miao Cai, Jing Xiao, Kailin Zhang and Guo- Qi Zhang. Failure Quantitative Assessment Approach to MOSFET Power Device by Detecting Parasitic Parameters. Frontiers in Physics. 2022. (SCI)

2022年以前发表期刊论文

1. He, S.*, Gao, R., Shen, Y-A., Li, J. and Nishikawa., H. “Wettability, Interfacial reactions, and Impact Strength of Sn-3.0Ag-0.5Cu Solder/ENIG Substrate Used for Fluxless Soldering under Formic Acid Atmosphere”,Journal of Materials Science, vol. 57 No. 7, pp. 3107-3117, 2020(SCI, 中科院二区TOP)

2. He, S.*, Gao, R., Li, J., Shen, Y-A. and Nishikawa, H., “In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere”,Materials chemistry and Physics, vol. 239, pp. 122309, 2020(SCI,)

3. He, S. and Nishikawa, H.*, Effect of Thermal Aging on the Impact Strength of Soldered Bumps under Formic acid Atmosphere. Quarterly Journal of The Japan Welding Society 35 (2017), pp.127-131.（EI）