部分已发表论文
1. Huang Jian, Wang Bi, Yuan Jingjie, Wu Xinke, Yan Haidong, Feng Qi, Cai Miao, Qin Hongbo*. Strengthening mechanism of electroplated Cu layer on sintered Cu joint[J]. Journal of Materials Research and Technology, 2026, 41:184-192. 通讯作者 |
2. Zhan Zhuangchao, Qin Hongbo*, Yang Daoguo, Huang Jian, Zhao Xiaohui, Cai Miao, Lin Chengxu, Pan Kailin. Creep behavior of Sn58Bi solder alloy: experiments and modeling[J]. Journal of Materials Science, 2025.通讯作者 |
3. Qin Hongbo, Zhu Shaohao, Huang Jian, Tan Quanzheng, Lin Jizhan, Wang Lili, Lin Chengxu, Liang Caihang, Huang Jiaqiang*. Comparative analysis of mechanical behavior between electroless and electroplated Ni layers and their influence on Si chip warpage[J]. Journal of Materials Science: Materials in Electronics, 2025, 36(21): 1318. 通讯作者 |
4. Qin Hongbo, Tan Quanzheng, Huang Jian, Wang Bi, Zhu Shaohao, Cai Miao, Zhu Yao, Zhao Xiaohui, Yin Can, Pan Kailin, Li Wangyun* Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles[J]. Soldering & Surface Mount Technology, 2025, 37(4): 320-332. 通讯作者 |
