主要论文
5篇代表作
1. W.Y. Li, C.T. Chen*, M. Nishijima, M. Ueshima, H. Nishikawa, K. Suganuma, Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition, Materials & Design, 2024, 246: 113308.
2. W.Y. Li*, L.Q. Liu, Elevated damping properties of lead-free solders under electric current stressing, Scripta Materialia, 2023, 226, 115230.
3. W.Y. Li*, L.Q. Mo, X.M. Li, J. Wang, H.B. Qin, S.L. He*, Minor Ag induced shear performance alternation in BGA structure Cu/SnBi/Cu solder joints under electric current stressing, Journal of Materials Research and Technology, 2023, 25, 6111-6122.
4. W.Y. Li, L.Q. Mo, F. Chen, Z.B. Dai, Y.Q. Xu, S.L. He*, H. Nishikawa*. Counter-intuitive mechanical performance variation in aged low-temperature interconnections in electronic packaging, Vacuum, 2024, 227: 113367.
5. F. Chen, L.Q. Mo, F. Hu, W.Y. Li*, S. Wei*, Synergistic effect of thermomigration and electric current stressing on damping capacity of Sn58Bi solder, Vacuum, 2025, 231: 113760.
期刊论文（一作&通讯作者）
6. W.Y. Li*, F. Chen, L.Q. Mo, F. Hu, L.Q. Liu, Y.Q. Xu*, Electric current stressing altered damping performance of aged inhomogeneous solders for low-temperature interconnection, Journal of Materials Science: Materials in Electronics, 2025, 36: 58. DOI: 10.1007/s10854-024-14097-9
7. W.Y. Li, L.G. Liu, F. Chen, Y.Q. Xu, H.B. Qin*, Y.B. Gong*, Lifetime prediction and fracture behavior of shear cycled Cu/Sn–3.0Ag–0.5Cu/Cu joints under current stressing, Journal of Materials Science: Materials in Electronics, 2024, 35: 1964.
8. S.Y. Chen, R.F. Li, H.X. Hu, J.D. Guo, S. Wei*, W.Y. Li*, Improving the thermal, mechanical, and insulating characteristics of thermal interface materials with liquid metal-based diphase structure, Journal of Materials Science, 2024, 59: 19125-19137.
9. B. Wang, W.Y. Li*, K.L. Pan*, W. Huang, Y.B. Gong, Size dependence on shear fatigue and fracture behavior of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing, Frontiers in Materials, 2024, 11: 1452773.
10. L.Q. Liu, F. Chen, W.Y. Li*. Electric current stressing enhanced damping properties in Sn5Sb solder, Soldering & Surface Mount Technology, 2024, 36(3): 185-191.
11. W.Y. Li*, L.Q. Liu, X.M. Li, Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions, Soldering & Surface Mount Technology, 2023, 35(2): 86-94.
12. W.Y. Li*, F. Chen, J. Gui, S.L. He, H.B. Qin, J.Q. Huang*, Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints at low temperatures, Microelectronics Reliability, 2023, 150, 115093.
13. W.Y. Li*, C.T. Chen, M. Ueshima, T. Kobatake, K. Suganuma, Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures, Microelectronics Reliability, 2023, 150, 115105.
14. Z.H. Zheng, S. Wei*, Y.R. Yang, D. Zhang, D.G. Yang, W.Y. Li*, J.D. Guo*. Low-temperature solidifiable liquid metal with ultrahigh thermal conductivity enabled by spontaneous phase transition for electronics' safety and long-life cooling. Advanced Engineering Materials, 2023, 25(11): 2201817.
15. Y.B. Gong, L.G. Liu, S.L. He, H.D. Yan, W.Y. Li*, H.B. Qin*, Shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu joints with same volume and different heights at increasing current density, Journal of Materials Science: Materials in Electronics, 2022, 33(32): 24906-24919.
16. B. Wang, W.Y. Li*, S.Y. Zhang, X.M. Li, K.L. Pan*, Effect of electric current stressing on mechanical performance of solders and solder joints: A review, Journal of Materials Science, 2022, 57(37): 17533-17562.
17. X.M. Li, J. Wang, H.B. Qin, S.L. He, W.Y. Li*, S. Wei*, Creep performance of phase-inhomogeneous Cu/Sn-58Bi/Cu solder joints with increasing current density, Journal of Materials Science: Materials in Electronics, 2022, 33(20): 16167-16182.
18. W.Y. Li, J. Gui, H.B. Qin*, D.G. Yang, Shear performance of microscale ball grid array structure Cu(Ni)/Sn-3.0Ag-0.5Cu/Cu(Ni) solder joints at low temperatures, Materials Today Communications, 2022, 20: 103149.
19. X.M. Li, J. Wang, J.Y. Liang, W.Y. Li*, H.B. Qin*, Weakened strengthening effect in the Ag added microscale SnBi joints under current stressing, Materials Letters, 2022, 312: 131677.
20. B. Wang, W.Y. Li*, K.L. Pan*, Abnormal shear performance of microscale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints with increasing current density, Crystals, 2022, 12, 85.
21. B. Wang, W.Y. Li*, K.L. Pan*, Shear performance of microscale ball grid array structure Sn-3.0Ag-0.5Cu solder joints with different surface finish combinations under electro–thermo–mechanical coupled loads, Journal of Materials Science: Materials in Electronics, 2022, 33: 4924–4939.
22. 李望云, 李兴民, 汪健, 梁泾洋, 秦红波*. 电-热-力耦合载荷下非均质Cu/Sn-58Bi/Cu微焊点拉伸力学性能研究, 机械工程学报, 2022, 58(2): 307-320.
23. H.B. Qin, C.Y. Lei, X.H. Luan, Q.Z. Wen, W.Y. Li*, Influence of microstructure evolution on the current density and temperature gradient of line-type Cu/Sn58Bi/Cu microscale solder joint under current stressing, Journal of Electronic Materials, 2022, 51: 1116-1127.
24. J. Gui, X.M. Li, J. Wang, W.Y. Li*, H.B. Qin*, Size effect on tensile performance of microscale Cu/Sn3.0Ag0.5Cu/Cu joints at low temperatures, Journal of Materials Science: Materials in Electronics, 2021, 32: 28454–28467.
25. H.B. Qin*, T.H. Liu, W.Y. Li*, W. Yue, D.G. Yang, Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing, Microelectronics Reliability, 2020, 115: 113995.
26. W.Y. Li, X.P. Zhang*, H.B. Qin, Y.-W. Mai, Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads, Microelectronics Reliability, 2018, 82: 224-227.
27. W.Y. Li, S.S. Cao, X.P. Zhang*, A novel and facile synthesis of nano SnO2 with various morphologies by electric current stressing, Rare Metal Materials and Engineering, 2018, 9: 2647-2651.
28. W.Y. Li, H. Jin, W. Yue, M.Y. Tan, X.P. Zhang*, Creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads, Journal of Materials Science: Materials in Electronics, 2016, 27(12), 13022-13033.
29. 李望云, 秦红波, 周敏波, 张新平*, 电-力耦合作用下Cu/Sn-3.0Ag-0.5Cu/Cu微焊点的拉伸力学性能和断裂行为, 机械工程学报, 2016, 52(10): 46-53.
期刊论文（非一作&通讯作者）
30. X. Wu, H.J. Jiang*, W.Y. Li, C.Y. Liu, H.F. Huang, S.H. Liu, L.L. Wei, Preparation of NiTip/Al composites with controllable phase transformation and damping behavior by friction stir processing, Science China Technological Sciences, 2024, 67: 597–607.
31. Y.X. Xu, X.M. Qiu, W.Y. Li, S.Y. Wang, N. Ma, M. Ueshima, C.T. Chen*, K. Suganuma. Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules. Journal of Materials Research and Technology, 2023, 26: 1079-1093.
32. C.Y. Ding, H.J. Jiang*, W.Y. Li, C.Y. Liu, H.F. Huang, S.H. Liu, L.L. Wei, Phase transition and damping behavior of Al matrix composites reinforced by a NiTi particle layer, Journal of Materials Science, 2023, 58: 17257–17274.
33. S.L. He, Y.A. Shen, B.F. Xiong, F.P. Huo, J.H. Li, J.G. Ge, Z.L. Pan, W.Y. Li, C. Hu, H. Nishikawa, Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere, Journal of Materials Research and Technology, 2022, 21: 2352-2361.
34. H.B. Qin*,W. Qin, W.Y. Li, X. Long*, Influence of phase inhomogeneity on the mechanical behavior of microscale Cu/Sn-58Bi/Cu solder joints, Journal of Materials Science: Materials in Electronics, 2022, 33: 244-259.
35. H.B. Qin*, T.F. Kuang, X.H. Luan, W.Y. Li, J. Xiao, P. Zhang*, D.G. Yang, G.Q. Zhang, Influence of pressure on the mechanical and electronic properties of wurtzite and zinc-blende GaN crystals, Crystals, 2018, 8: 428.
36. H.B. Qin, W.Y. Li, M.B. Zhou, X.P. Zhang*, Low cycle fatigue performance of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Microelectronics Reliability, 2014, 54(12): 2911-2921.
37. 秦红波, 李望云, 李勋平, 张新平*, BGA结构无铅微焊点的低周疲劳行为研究, 机械工程学报, 2014, 50(20): 54-62.
会议论文
1. S.B. Liang, W.Y. Li, H. Jiang, Z.H. Guo, Z.H. Zhong. Effect of phase evolution on inhomogeneous deformation and fracture behavior in Sn-Bi solder alloys, International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April, 2024.
2. Y. Zhu, H.D. Yan*,W.Y. Li*, X.L. Yan, Y.K. Zhang, C.H. Liu, Low-temperature pressureless copper sintering under formic acid atmosphere. International Conference on Electronic Packaging Technology (ICEPT). Tianjin, China, 7-9 Aug, 2024.
3. W.Y. Li, C.T. Chen, Y. Liu, M. Ueshima, T. Sakamoto, K. Suganuma. Effect of aging and thermal shock on the reliability of silver sintered die attach for SiC power devices. International Conference on Electronics Packaging (ICEP). Kumamoto, Japan, 19-22 April, 2023: 141-142.
4. C.T. Chen, Y. Liu, W.Y. Li, F.P. Huo, M. Ueshima, T. Sakamoto, Y. Oda, K. Suganuma. High reliability design Ag sinter joining on softened Ni-P/Pt/Ag metallization substrate during harsh thermal cycling. IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023: 651-655.
5. M.C. Hsieh, Z. Zhang, M. Nishijima, A. Suetake, C.T. Chen, H. Yoshida, W.Y. Li, R. Okumura, H. Homma, K. Kita, G. Okada, K. Suganuma. Fine pitch micro via interconnection with reliable electroless/electric Cu plating layers combined with high power DUV picosecond laser for organic substrates. IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023: 1381-1384.
6. L.B. Zhang, C.T. Chen, F.P. Huo, W.Y. Li, K. Suganuma. Rapid silver sinter joining technology for large area chips. International Conference on Electronics Packaging (ICEP). IEEE, 2023: 249-250.
7. Y.C. Liu, H.D. Yan, D.G. Yang, W.Y. Li, C.H. Liu, Y.K. Zhang. A wire-less SiC power module using flip-chip sintering method, 2023 24th International Conference on Electronic Packaging Technology (ICEPT), Shihezi, China, 8-11 Aug, 2023. DOI: 10.1109/ICEPT59018.2023.10492382.
8. Y.X. Fan, H.D. Yan, D.G. Yang, W.Y. Li, C.H. Liu, Y.K. Zhang. Design and integration approach of low-inductance vertical interconnection structure for Gallium-Nitride high electron mobility transistors, 2023 24th International Conference on Electronic Packaging Technology (ICEPT), Shihezi, China, 8-11 Aug, 2023. DOI: 10.1109/ICEPT59018.2023.10492382.
9. C.T. Chen, Y. Liu, W.Y. Li, M. Ueshima, K. Nakayama, K. Suganuma. Development of micron-sized Ag-Si composite paste die attach material for highly stable microstructure during high temperate aging. IEEE 25th Electronics Packaging Technology Conference (EPTC), Singapore, 5-8 Dec. 2023. DOI: 10.1109/EPTC59621.2023.10457613.
10. L.G. Liu, B. Wang, W.Y. Li, Y.B. Gong, K.L. Pan. Fatigue performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints at different current densities. IEEE 24th Electronics Packaging Technology Conference (EPTC), Singapore, 7-9 Dec. 2022: 791-794. DOI: 10.1109/EPTC56328.2022.10013209.
11. B. Wang, W.Y. Li*, W. Huang, Y.B. Gong, J. Xu, K.L. Pan, The breakdown of Anand constitutive model in life prediction on microscale BGA structure Sn-3.0Ag-0.5Cu solder joints under current stressing, 23th International Conference on Electronic Packaging Technology, Dalian, China, 9-11 Aug, 2022. DOI: 10.1109/ICEPT56209.2022.9873211.
12. L.Q. Mo, X.L. Chen, L.G. Liu, Y.B. Gong, H.B. Qin, W.Y. Li*, The addition of Ag on the shear performance of aged BGA structure SnBi solder joints with same volume and different thickness, 23th International Conference on Electronic Packaging Technology, Dalian, China, 9-11 Aug, 2022.
13. L.H. Jiang, T.H. Liu, S.L. He, H.B. Qin*, W.Y. Li, D.G. Yang, Adsorption behavior of HCOOH on the crystal surfaces of Cu(111) and (100), 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9567947.
14. J.Q. Tang, T.H. Liu, C. Ding, J. Wang, H.B. Qin*, W.Y. Li. Effect of IMC morphology on the current density and temperature gradient of line-type Cu/Sn/Cu solder joint, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568011.
15. J.Y. Li, W.Y. Li, D.G. Yang*, Y.K. Qin, S.C. Cao, F.X. Liu, Optical performance analysis of UVC-LED package structure based on ray-tracing simulation, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568171.
16. G.S. Lu, D.G. Yang*, W.Y. Li, X.Y. Wang, X.L. Wei, B.J. Ai, Study on leadframe overflow prevention of soldering paste using fluid-structure coupling analysis, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568000.
17. X.L. Wei, D.G. Yang*, W.Y. Li, X.Y. Wang, G.S. Lu, S.R. Xue, Research on thermal characteristics of high power 3D microchannel multichip package, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568240.
18. Y.H. Bi, S.L. He*, W.Y. Li*, D.G. Yang, H. Nishikawa, Wettability improvement of solder in fluxless soldering under formic acid atmosphere, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568105.
19. S.C. Cao, D.G. Yang, W.Y. Li*, X.Y. Wang, S.R. Xue, Z.F. Yun, Study on Gold Wire Sweep in Cantilever Chip-Stacked Package during Molding Process, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568050.
20. C.Y. Lei, X.H. Luan, Z.G. Liu, H.B. Qin*, B. Hou*, W.Y. Li. The mechanical and physical properties of the phases in the microstructure of Sn- Bi solder alloy, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568050.
21. J. Gui, X.M. Li, W.Y. Li*, H.D. Yan, H.B. Qin, J.Q. Huang, D.G. Yang, Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints after deep cryogenic treatment with different time, 21th International Conference on Electronic Packaging Technology, Guangzhou, China, 11-15 Aug, 2020. DOI: 10.1109/ICEPT50128.2020.9202647.
22. X.M. Li, J. Gui, W.Y. Li*, H.D. Yan, H.B. Qin, J.Q. Huang, D.G. Yang, Tensile performance of line-type microscale Cu/Sn-58Bi/Cu joints under electro-thermo-mechanical coupled loads, 21th International Conference on Electronic Packaging Technology, Guangzhou, China, 11-15 Aug, 2020. DOI: 10.1109/ICEPT50128.2020.9202518.
23. P.J. Liang, H.D. Yan*, W.Y. Li, D.G. Yang, Void eliminating process of sintered-silver die attachment in anaerobic-sintering atmospheres, 21th International Conference on Electronic Packaging Technology, Guangzhou, China, 11-15 Aug, 2020. DOI: 10.1109/ICEPT50128.2020.9202689.
24. W. Qin, T.F. Kuang, C. Ding, C.Y. Lei, W.Y. Li, H.B. Qin*, Research on the anisotropic mechanical behavior of microscale Sn58Bi solder matrix via finite element simulation, 21th International Conference on Electronic Packaging Technology, Guangzhou, China, 11-15 Aug, 2020. DOI: 10.1109/ICEPT50128.2020.9202950.
25. W.Y. Li*, G.Q. Peng, T.X. Cheng, H.B. Qin, J.Q. Huang, D.G. Yang, Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints with shrinking volume at low and cryogenic temperatures, 20th International Conference on Electronic Packaging Technology, Hongkong, China, 11-15 Aug, 2019. DOI: 10.1109/ICEPT47577.2019.245195.
26. T.F. Kuang, H.B. Qin*, W.Y. Li**, D.G. Yang, Anisotropic mechanical characteristics of Cu6Sn5 micro-cantilever under bending load, 20th International Conference on Electronic Packaging Technology, Hongkong, China, 11-15 Aug, 2019. DOI: 10.1109/ICEPT47577.2019.245279.
27. Q.Z. Wen, L.Guo, H.B. Qin*, W.Y. Li, D.G. Yang, The influence of phase inhomogeneity on the current density and temperature gradient in Cu/Sn58Bi/Cu solder joint, 20th International Conference on Electronic Packaging Technology, Hongkong, China, 11-15 Aug, 2019. DOI: 10.1109/ICEPT47577.2019.245309.
28. X.Y. Wang, D.G. Yang*, Y.S. Fan, W.Y. Li, Analysis of temperature response characteristics of voltage RMS sensor packaging based on diode, 20th International Conference on Electronic Packaging Technology, Hongkong, China, 11-15 Aug, 2019. DOI: 10.1109/ICEPT47577.2019.245123.
29. W.Y. Li, X.P. Zhang*, Low and cryogenic temperature mechanical performance and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints with the decreasing dimension, 19th International Conference on Electronic Packaging Technology, Shanghai, China, 8-11 Aug, 2018. DOI: 10.1109/ICEPT.2018.8480659.
30. W.Y. Li, M.B. Zhou, X.P. Zhang*, Abnormal creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints with different joint thicknesses under electro-thermo-mechanical coupled loads, 18th International Conference on Electronic Packaging Technology, Harbin, China, 16-19 Aug, 2017. DOI: 10.1109/ICEPT.2017.8046751.
31. W.Y. Li, S.S. Cao, X.P. Zhang*, Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, 17th International Conference on Electronic Packaging Technology, Wuhan, China, 16-19 Aug, 2016, 860-864.
32. W.Y. Li, S.S. Cao, X.P. Zhang*, Creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads, 17th International Conference on Electronic Packaging Technology, Wuhan, China, 16-19 Aug, 2016, 988-993.
33. W.Y. Li, M.B. Zhou, X.P. Zhang*, Creep behavior of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under tensile stress coupled with DC current stressing, 16th International Conference on Electronic Packaging Technology, Changsha, China, 11-14 Aug, 2015, 187-192.
34. W.Y. Li, H.B. Qin, M.B. Zhou, X.P. Zhang*, The influence of imposed electric current on the tensile fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, 15th International Conference on Electronic Packaging Technology, Chengdu, China, 12-15 Aug, 2014, 1030-1034.
35. J.Q. Huang, M.B. Zhou, W.Y. Li, X.P. Zhang*, Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on BGA packaging, 17th International Conference on Electronic Packaging Technology, Wuhan, China, 16-19 Aug, 2016, 1010-1014.
36. J.Q. Huang, M.B. Zhou, W.Y. Li, X.P. Zhang*, Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging, 16th International Conference on Electronic Packaging Technology, Changsha, China, 11-14 Aug, 2015, 307-311.
37. L.M. Yin*, W.Y. Li, S. Wei, Z.L. Xu, Size and volume effects in microscale solder joint of electronic packaging. 12th International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, 8-11 Aug, 2011, 832-834.
38. 秦红波, 宇文惠惠, 李望云, 张新平*, TSV结构微凸点互连热疲劳寿命的研究, 2013中国力学大会(“先进电子封装技术中的力学问题”主题分会), 2013年8月19-21日, 西安, A31-0842.
