1. 国家自然科学基金地区基金项目，52365042，电-热-力耦合场下基体相形态对微凸点焊点疲劳行为的影响及寿命预测研究，2024.01-2027.12，32万元，在研，主持。

2. 国家自然科学基金青年基金项目，51805103，结构和组织不均匀微凸点焊点在电-热-力耦合场下的蠕变行为研究，2019.01-2021.12，27万元，已结题，主持。

3. 国家自然科学基金地区基金项目，52065015，电子封装非均质各向异性微焊点微观力学行为及失效机理研究，2021.01-2024.12，35万元，排名第二。

4. 国家自然科学基金地区基金项目，51967005，银纳米颗粒焊膏低温无压连接铜基-SiC器件的无氧烧结机理研究，2020.01-2023.12，39万元，排名第三。

5. 广西自然科学基金科技基地和人才专项，桂科AD18281021，电-热-力耦合场下非均质微凸点焊点蠕变行为和失效机制的研究，2018.12-2021.11，18万元，已结题，主持。

6. 广西自然科学基金青年科学基金项目，2018GXNSFBA281065，电流密度分布特征对电-热-力耦合场下微凸点焊点蠕变行为影响的研究，2019.01-2021.12，10万元，已结题，主持。

7. 广西制造系统与先进制造技术重点实验室2024年度主任基金项目，24354S006，相形态非均匀微焊点在电-热-力耦合场下的疲劳失效与尺寸效应研究，2024.07 -2026.07，2万元，在研，主持。

8. 广西制造系统与先进制造技术重点实验室2019年度主任课题，19-050-44-003Z，极寒环境下Sn基无铅微焊点的蠕变变形与失效机制研究，2019.09 -2021.08，3万元，已结题，主持。

9. 电子信息材料与器件教育部工程研究中心2020年一般项目，EIMD-AB202005，电子封装Sn基无铅微焊点在低温下的蠕变变形与失效机制研究，2020.10 -2022.09，2万元，已结题，主持。

10. 广西创新驱动发展专项，桂科AA21077015，面向5G应用的高速存储芯片叠层封装测试工艺开发与产业化，2021.04-2024.03，500万元，排名第七。

11. 广西自然科学基金面上项目，2018GXNSFAA281222，高密度封装微焊点组织不均匀性与物相各向异性研究，2019.01-2021.12，12万元，排名第三。

12. 广西自然科学基金面上项目，2018GXNSFAA294082，纳米银焊膏的甲酸辅助烧结机理与裸铜基车用碳化硅功率器件的关键封装技术研究，2019.01-2020.12，10万元，排名第二。

13. 国家自然科学基金面上项目，51775195，电-热-力耦合场下TSV铜柱胀缩行为与微凸点焊点的交互作用及对互连可靠性的影响，2018.01-2021.12，62万元，排名第六。

主要论文

5篇代表作

1. W.Y. Li, C.T. Chen*, M. Nishijima, M. Ueshima, H. Nishikawa, K. Suganuma, Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition, Materials & Design, 2024, 246: 113308.

2. W.Y. Li*, L.Q. Liu, Elevated damping properties of lead-free solders under electric current stressing, Scripta Materialia, 2023, 226, 115230.

3. W.Y. Li*, L.Q. Mo, X.M. Li, J. Wang, H.B. Qin, S.L. He*, Minor Ag induced shear performance alternation in BGA structure Cu/SnBi/Cu solder joints under electric current stressing, Journal of Materials Research and Technology, 2023, 25, 6111-6122.

4. W.Y. Li, L.Q. Mo, F. Chen, Z.B. Dai, Y.Q. Xu, S.L. He*, H. Nishikawa*. Counter-intuitive mechanical performance variation in aged low-temperature interconnections in electronic packaging, Vacuum, 2024, 227: 113367.

5. F. Chen, L.Q. Mo, F. Hu, W.Y. Li*, S. Wei*, Synergistic effect of thermomigration and electric current stressing on damping capacity of Sn58Bi solder, Vacuum, 2025, 231: 113760. 

期刊论文（一作&通讯作者）

6. W.Y. Li*, F. Chen, L.Q. Mo, F. Hu, L.Q. Liu, Y.Q. Xu*, Electric current stressing altered damping performance of aged inhomogeneous solders for low-temperature interconnection, Journal of Materials Science: Materials in Electronics, 2025, 36: 58. DOI: 10.1007/s10854-024-14097-9

7. W.Y. Li, L.G. Liu, F. Chen, Y.Q. Xu, H.B. Qin*, Y.B. Gong*, Lifetime prediction and fracture behavior of shear cycled Cu/Sn–3.0Ag–0.5Cu/Cu joints under current stressing, Journal of Materials Science: Materials in Electronics, 2024, 35: 1964.

8. S.Y. Chen, R.F. Li, H.X. Hu, J.D. Guo, S. Wei*, W.Y. Li*, Improving the thermal, mechanical, and insulating characteristics of thermal interface materials with liquid metal-based diphase structure, Journal of Materials Science, 2024, 59: 19125-19137.

9. B. Wang, W.Y. Li*, K.L. Pan*, W. Huang, Y.B. Gong, Size dependence on shear fatigue and fracture behavior of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing, Frontiers in Materials, 2024, 11: 1452773.

10. L.Q. Liu, F. Chen, W.Y. Li*. Electric current stressing enhanced damping properties in Sn5Sb solder, Soldering & Surface Mount Technology, 2024, 36(3): 185-191.

11. W.Y. Li*, L.Q. Liu, X.M. Li, Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions, Soldering & Surface Mount Technology, 2023, 35(2): 86-94. 

12. W.Y. Li*, F. Chen, J. Gui, S.L. He, H.B. Qin, J.Q. Huang*, Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints at low temperatures, Microelectronics Reliability, 2023, 150, 115093.

13. W.Y. Li*, C.T. Chen, M. Ueshima, T. Kobatake, K. Suganuma, Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures, Microelectronics Reliability, 2023, 150, 115105.

14. Z.H. Zheng, S. Wei*, Y.R. Yang, D. Zhang, D.G. Yang, W.Y. Li*, J.D. Guo*. Low-temperature solidifiable liquid metal with ultrahigh thermal conductivity enabled by spontaneous phase transition for electronics' safety and long-life cooling. Advanced Engineering Materials, 2023, 25(11): 2201817. 

15. Y.B. Gong, L.G. Liu, S.L. He, H.D. Yan, W.Y. Li*, H.B. Qin*, Shear performance of Cu/Sn-3.0Ag-0.5Cu/Cu joints with same volume and different heights at increasing current density, Journal of Materials Science: Materials in Electronics, 2022, 33(32): 24906-24919.

16. B. Wang, W.Y. Li*, S.Y. Zhang, X.M. Li, K.L. Pan*, Effect of electric current stressing on mechanical performance of solders and solder joints: A review, Journal of Materials Science, 2022, 57(37): 17533-17562. 

17. X.M. Li, J. Wang, H.B. Qin, S.L. He, W.Y. Li*, S. Wei*, Creep performance of phase-inhomogeneous Cu/Sn-58Bi/Cu solder joints with increasing current density, Journal of Materials Science: Materials in Electronics, 2022, 33(20): 16167-16182. 

18. W.Y. Li, J. Gui, H.B. Qin*, D.G. Yang, Shear performance of microscale ball grid array structure Cu(Ni)/Sn-3.0Ag-0.5Cu/Cu(Ni) solder joints at low temperatures, Materials Today Communications, 2022, 20: 103149.

19. X.M. Li, J. Wang, J.Y. Liang, W.Y. Li*, H.B. Qin*, Weakened strengthening effect in the Ag added microscale SnBi joints under current stressing, Materials Letters, 2022, 312: 131677.

20. B. Wang, W.Y. Li*, K.L. Pan*, Abnormal shear performance of microscale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints with increasing current density, Crystals, 2022, 12, 85.

21. B. Wang, W.Y. Li*, K.L. Pan*, Shear performance of microscale ball grid array structure Sn-3.0Ag-0.5Cu solder joints with different surface finish combinations under electro–thermo–mechanical coupled loads, Journal of Materials Science: Materials in Electronics, 2022, 33: 4924–4939.

22. 李望云, 李兴民, 汪健, 梁泾洋, 秦红波*. 电-热-力耦合载荷下非均质Cu/Sn-58Bi/Cu微焊点拉伸力学性能研究, 机械工程学报, 2022, 58(2): 307-320. 

23. H.B. Qin, C.Y. Lei, X.H. Luan, Q.Z. Wen, W.Y. Li*, Influence of microstructure evolution on the current density and temperature gradient of line-type Cu/Sn58Bi/Cu microscale solder joint under current stressing, Journal of Electronic Materials, 2022, 51: 1116-1127.

24. J. Gui, X.M. Li, J. Wang, W.Y. Li*, H.B. Qin*, Size effect on tensile performance of microscale Cu/Sn3.0Ag0.5Cu/Cu joints at low temperatures, Journal of Materials Science: Materials in Electronics, 2021, 32: 28454–28467.

25. H.B. Qin*, T.H. Liu, W.Y. Li*, W. Yue, D.G. Yang, Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing, Microelectronics Reliability, 2020, 115: 113995.

26. W.Y. Li, X.P. Zhang*, H.B. Qin, Y.-W. Mai, Joule heating dominated fracture behavior change in micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu(Ni) joints under electro-thermal coupled loads, Microelectronics Reliability, 2018, 82: 224-227.

27. W.Y. Li, S.S. Cao, X.P. Zhang*, A novel and facile synthesis of nano SnO₂ with various morphologies by electric current stressing, Rare Metal Materials and Engineering, 2018, 9: 2647-2651. 

28. W.Y. Li, H. Jin, W. Yue, M.Y. Tan, X.P. Zhang*, Creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads, Journal of Materials Science: Materials in Electronics, 2016, 27(12), 13022-13033.

29. 李望云, 秦红波, 周敏波, 张新平*, 电-力耦合作用下Cu/Sn-3.0Ag-0.5Cu/Cu微焊点的拉伸力学性能和断裂行为, 机械工程学报, 2016, 52(10): 46-53.

期刊论文（非一作&通讯作者）

30. X. Wu, H.J. Jiang*, W.Y. Li, C.Y. Liu, H.F. Huang, S.H. Liu, L.L. Wei, Preparation of NiTip/Al composites with controllable phase transformation and damping behavior by friction stir processing, Science China Technological Sciences, 2024, 67: 597–607.

31. Y.X. Xu, X.M. Qiu, W.Y. Li, S.Y. Wang, N. Ma, M. Ueshima, C.T. Chen*, K. Suganuma. Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules. Journal of Materials Research and Technology, 2023, 26: 1079-1093.

32. C.Y. Ding, H.J. Jiang*, W.Y. Li, C.Y. Liu, H.F. Huang, S.H. Liu, L.L. Wei, Phase transition and damping behavior of Al matrix composites reinforced by a NiTi particle layer, Journal of Materials Science, 2023, 58: 17257–17274.

33. S.L. He, Y.A. Shen, B.F. Xiong, F.P. Huo, J.H. Li, J.G. Ge, Z.L. Pan, W.Y. Li, C. Hu, H. Nishikawa, Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere, Journal of Materials Research and Technology, 2022, 21: 2352-2361.

34. H.B. Qin*,W. Qin, W.Y. Li, X. Long*, Influence of phase inhomogeneity on the mechanical behavior of microscale Cu/Sn-58Bi/Cu solder joints, Journal of Materials Science: Materials in Electronics, 2022, 33: 244-259.

35. H.B. Qin*, T.F. Kuang, X.H. Luan, W.Y. Li, J. Xiao, P. Zhang*, D.G. Yang, G.Q. Zhang, Influence of pressure on the mechanical and electronic properties of wurtzite and zinc-blende GaN crystals, Crystals, 2018, 8: 428.

36. H.B. Qin, W.Y. Li, M.B. Zhou, X.P. Zhang*, Low cycle fatigue performance of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, Microelectronics Reliability, 2014, 54(12): 2911-2921.

37. 秦红波, 李望云, 李勋平, 张新平*, BGA结构无铅微焊点的低周疲劳行为研究, 机械工程学报, 2014, 50(20): 54-62. 

会议论文

1. S.B. Liang, W.Y. Li, H. Jiang, Z.H. Guo, Z.H. Zhong. Effect of phase evolution on inhomogeneous deformation and fracture behavior in Sn-Bi solder alloys, International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April, 2024.

2. Y. Zhu, H.D. Yan*,W.Y. Li*, X.L. Yan, Y.K. Zhang, C.H. Liu, Low-temperature pressureless copper sintering under formic acid atmosphere. International Conference on Electronic Packaging Technology (ICEPT). Tianjin, China, 7-9 Aug, 2024.

3. W.Y. Li, C.T. Chen, Y. Liu, M. Ueshima, T. Sakamoto, K. Suganuma. Effect of aging and thermal shock on the reliability of silver sintered die attach for SiC power devices. International Conference on Electronics Packaging (ICEP). Kumamoto, Japan, 19-22 April, 2023: 141-142. 

4. C.T. Chen, Y. Liu, W.Y. Li, F.P. Huo, M. Ueshima, T. Sakamoto, Y. Oda, K. Suganuma. High reliability design Ag sinter joining on softened Ni-P/Pt/Ag metallization substrate during harsh thermal cycling. IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023: 651-655.

5. M.C. Hsieh, Z. Zhang, M. Nishijima, A. Suetake, C.T. Chen, H. Yoshida, W.Y. Li, R. Okumura, H. Homma, K. Kita, G. Okada, K. Suganuma. Fine pitch micro via interconnection with reliable electroless/electric Cu plating layers combined with high power DUV picosecond laser for organic substrates. IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023: 1381-1384.

6. L.B. Zhang, C.T. Chen, F.P. Huo, W.Y. Li, K. Suganuma. Rapid silver sinter joining technology for large area chips. International Conference on Electronics Packaging (ICEP). IEEE, 2023: 249-250.

7. Y.C. Liu, H.D. Yan, D.G. Yang, W.Y. Li, C.H. Liu, Y.K. Zhang. A wire-less SiC power module using flip-chip sintering method, 2023 24th International Conference on Electronic Packaging Technology (ICEPT), Shihezi, China, 8-11 Aug, 2023. DOI: 10.1109/ICEPT59018.2023.10492382.

8. Y.X. Fan, H.D. Yan, D.G. Yang, W.Y. Li, C.H. Liu, Y.K. Zhang. Design and integration approach of low-inductance vertical interconnection structure for Gallium-Nitride high electron mobility transistors, 2023 24th International Conference on Electronic Packaging Technology (ICEPT), Shihezi, China, 8-11 Aug, 2023. DOI: 10.1109/ICEPT59018.2023.10492382.

9. C.T. Chen, Y. Liu, W.Y. Li, M. Ueshima, K. Nakayama, K. Suganuma. Development of micron-sized Ag-Si composite paste die attach material for highly stable microstructure during high temperate aging. IEEE 25th Electronics Packaging Technology Conference (EPTC), Singapore, 5-8 Dec. 2023. DOI: 10.1109/EPTC59621.2023.10457613.

10. L.G. Liu, B. Wang, W.Y. Li, Y.B. Gong, K.L. Pan. Fatigue performance of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints at different current densities. IEEE 24th Electronics Packaging Technology Conference (EPTC), Singapore, 7-9 Dec. 2022: 791-794. DOI: 10.1109/EPTC56328.2022.10013209.

11. B. Wang, W.Y. Li*, W. Huang, Y.B. Gong, J. Xu, K.L. Pan, The breakdown of Anand constitutive model in life prediction on microscale BGA structure Sn-3.0Ag-0.5Cu solder joints under current stressing, 23th International Conference on Electronic Packaging Technology, Dalian, China, 9-11 Aug, 2022. DOI: 10.1109/ICEPT56209.2022.9873211.

12. L.Q. Mo, X.L. Chen, L.G. Liu, Y.B. Gong, H.B. Qin, W.Y. Li*, The addition of Ag on the shear performance of aged BGA structure SnBi solder joints with same volume and different thickness, 23th International Conference on Electronic Packaging Technology, Dalian, China, 9-11 Aug, 2022.

13. L.H. Jiang, T.H. Liu, S.L. He, H.B. Qin*, W.Y. Li, D.G. Yang, Adsorption behavior of HCOOH on the crystal surfaces of Cu(111) and (100), 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9567947.

14. J.Q. Tang, T.H. Liu, C. Ding, J. Wang, H.B. Qin*, W.Y. Li. Effect of IMC morphology on the current density and temperature gradient of line-type Cu/Sn/Cu solder joint, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568011.

15. J.Y. Li, W.Y. Li, D.G. Yang*, Y.K. Qin, S.C. Cao, F.X. Liu, Optical performance analysis of UVC-LED package structure based on ray-tracing simulation, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568171.

16. G.S. Lu, D.G. Yang*, W.Y. Li, X.Y. Wang, X.L. Wei, B.J. Ai, Study on leadframe overflow prevention of soldering paste using fluid-structure coupling analysis, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568000.

17. X.L. Wei, D.G. Yang*, W.Y. Li, X.Y. Wang, G.S. Lu, S.R. Xue, Research on thermal characteristics of high power 3D microchannel multichip package, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568240.

18. Y.H. Bi, S.L. He*, W.Y. Li*, D.G. Yang, H. Nishikawa, Wettability improvement of solder in fluxless soldering under formic acid atmosphere, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568105.

19. S.C. Cao, D.G. Yang, W.Y. Li*, X.Y. Wang, S.R. Xue, Z.F. Yun, Study on Gold Wire Sweep in Cantilever Chip-Stacked Package during Molding Process, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568050.

20. C.Y. Lei, X.H. Luan, Z.G. Liu, H.B. Qin*, B. Hou*, W.Y. Li. The mechanical and physical properties of the phases in the microstructure of Sn- Bi solder alloy, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 11-15 Aug, 2021. DOI: 10.1109/ICEPT52650.2021.9568050.

21. J. Gui, X.M. Li, W.Y. Li*, H.D. Yan, H.B. Qin, J.Q. Huang, D.G. Yang, Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints after deep cryogenic treatment with different time, 21th International Conference on Electronic Packaging Technology, Guangzhou, China, 11-15 Aug, 2020. DOI: 10.1109/ICEPT50128.2020.9202647.

22. X.M. Li, J. Gui, W.Y. Li*, H.D. Yan, H.B. Qin, J.Q. Huang, D.G. Yang, Tensile performance of line-type microscale Cu/Sn-58Bi/Cu joints under electro-thermo-mechanical coupled loads, 21th International Conference on Electronic Packaging Technology, Guangzhou, China, 11-15 Aug, 2020. DOI: 10.1109/ICEPT50128.2020.9202518.

23. P.J. Liang, H.D. Yan*, W.Y. Li, D.G. Yang, Void eliminating process of sintered-silver die attachment in anaerobic-sintering atmospheres, 21th International Conference on Electronic Packaging Technology, Guangzhou, China, 11-15 Aug, 2020. DOI: 10.1109/ICEPT50128.2020.9202689.

24. W. Qin, T.F. Kuang, C. Ding, C.Y. Lei, W.Y. Li, H.B. Qin*, Research on the anisotropic mechanical behavior of microscale Sn58Bi solder matrix via finite element simulation, 21th International Conference on Electronic Packaging Technology, Guangzhou, China, 11-15 Aug, 2020. DOI: 10.1109/ICEPT50128.2020.9202950.

25. W.Y. Li*, G.Q. Peng, T.X. Cheng, H.B. Qin, J.Q. Huang, D.G. Yang, Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints with shrinking volume at low and cryogenic temperatures, 20th International Conference on Electronic Packaging Technology, Hongkong, China, 11-15 Aug, 2019. DOI: 10.1109/ICEPT47577.2019.245195.

26. T.F. Kuang, H.B. Qin*, W.Y. Li**, D.G. Yang, Anisotropic mechanical characteristics of Cu6Sn5 micro-cantilever under bending load, 20th International Conference on Electronic Packaging Technology, Hongkong, China, 11-15 Aug, 2019. DOI: 10.1109/ICEPT47577.2019.245279.

27. Q.Z. Wen, L.Guo, H.B. Qin*, W.Y. Li, D.G. Yang, The influence of phase inhomogeneity on the current density and temperature gradient in Cu/Sn58Bi/Cu solder joint, 20th International Conference on Electronic Packaging Technology, Hongkong, China, 11-15 Aug, 2019. DOI: 10.1109/ICEPT47577.2019.245309.

28. X.Y. Wang, D.G. Yang*, Y.S. Fan, W.Y. Li, Analysis of temperature response characteristics of voltage RMS sensor packaging based on diode, 20th International Conference on Electronic Packaging Technology, Hongkong, China, 11-15 Aug, 2019. DOI: 10.1109/ICEPT47577.2019.245123.

29. W.Y. Li, X.P. Zhang*, Low and cryogenic temperature mechanical performance and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints with the decreasing dimension, 19th International Conference on Electronic Packaging Technology, Shanghai, China, 8-11 Aug, 2018. DOI: 10.1109/ICEPT.2018.8480659.

30. W.Y. Li, M.B. Zhou, X.P. Zhang*, Abnormal creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints with different joint thicknesses under electro-thermo-mechanical coupled loads, 18th International Conference on Electronic Packaging Technology, Harbin, China, 16-19 Aug, 2017. DOI: 10.1109/ICEPT.2017.8046751.

31. W.Y. Li, S.S. Cao, X.P. Zhang*, Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, 17th International Conference on Electronic Packaging Technology, Wuhan, China, 16-19 Aug, 2016, 860-864.

32. W.Y. Li, S.S. Cao, X.P. Zhang*, Creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo-mechanical coupled loads, 17th International Conference on Electronic Packaging Technology, Wuhan, China, 16-19 Aug, 2016, 988-993. 

33. W.Y. Li, M.B. Zhou, X.P. Zhang*, Creep behavior of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under tensile stress coupled with DC current stressing, 16th International Conference on Electronic Packaging Technology, Changsha, China, 11-14 Aug, 2015, 187-192. 

34. W.Y. Li, H.B. Qin, M.B. Zhou, X.P. Zhang*, The influence of imposed electric current on the tensile fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints, 15th International Conference on Electronic Packaging Technology, Chengdu, China, 12-15 Aug, 2014, 1030-1034. 

35. J.Q. Huang, M.B. Zhou, W.Y. Li, X.P. Zhang*, Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on BGA packaging, 17th International Conference on Electronic Packaging Technology, Wuhan, China, 16-19 Aug, 2016, 1010-1014. 

36. J.Q. Huang, M.B. Zhou, W.Y. Li, X.P. Zhang*, Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging, 16th International Conference on Electronic Packaging Technology, Changsha, China, 11-14 Aug, 2015, 307-311. 

37. L.M. Yin*, W.Y. Li, S. Wei, Z.L. Xu, Size and volume effects in microscale solder joint of electronic packaging. 12th International Conference on Electronic Packaging Technology & High Density Packaging, Shanghai, China, 8-11 Aug, 2011, 832-834. 

38. 秦红波, 宇文惠惠, 李望云, 张新平*, TSV结构微凸点互连热疲劳寿命的研究, 2013中国力学大会(“先进电子封装技术中的力学问题”主题分会), 2013年8月19-21日, 西安, A31-0842.

专利概况

1. 李望云, 李兴民, 位松, 秦红波, 黄家强, 刘东静. 一种通电下薄膜材料热膨胀系数的测试装置及测试方法, 发明专利, ZL202111239076.6, 申请日期: 2021年10月25日, 授权公告日: 2024年9月20日

2. 李望云, 莫兰清, 何思亮, 位松, 秦红波, 黄家强. 一种微电子用Sn58Bi钎料合金微互连焊点的时效强化工艺, 发明专利, 2023109779443, 申请日期: 2023年08月04日.

3. 李望云, 莫兰清, 位松, 秦红波, 黄家强, 刘东静. 一种宽温度范围通电下的剪切推球实验装置, 实用新型专利, ZL202222325770.6, 申请日期: 2022年09月01日, 授权公告日: 2022年12月20日

4. 李望云, 李兴民, 位松, 秦红波, 黄家强, 刘东静. 一种电流作用下微焊点极限冷热循环冲击可靠性测试装置, 实用新型专利, ZL202122731908.8, 申请日期: 2021年11月09日, 授权公告日: 2022年4月5日

5. 李望云, 李兴民, 位松, 秦红波, 黄家强, 刘东静. 一种微焊点在电-热-力-磁耦合场作用下的实验装置, 实用新型专利, ZL202122585374.2, 申请日期: 2021年10月26日, 授权公告日: 2022年5月6日

6. 李望云, 郑增煌, 位松, 秦红波, 黄家强, 刘东静. 一种用于存储制备镓基热界面材料原料的固液两相分离胶囊, 实用新型专利, ZL202122564678.0, 申请日期: 2021年10月25日, 授权公告日: 2022年3月22日

7. 李望云, 桂俊, 位松, 秦红波, 黄家强, 刘东静. 一种用于储存液氮罐的连通供液装置, 实用新型专利, ZL202122571732.4, 申请日期: 2021年10月25日, 授权公告日: 2022年3月22日

8. 李望云, 刘林强, 位松, 秦红波, 黄家强, 刘东静. 一种电流作用下损耗因子测试装置及测试方法, 发明专利, 申请号: 202111113073.8, 申请日期: 2021年9月23日

9. 李望云, 刘林强, 何思亮, 秦红波, 黄家强, 位松, 刘东静. 一种电流作用下阻尼材料的高温激活能测试方法及蠕变机制预测方法, 发明专利, 申请号: 202211089345.X, 申请日期: 2022年9月7日.

10. 何思亮, 胡靓颖, 熊苾富, 李望云, 毕宇浩, 江剑. 一种基于甲酸气氛下锡淀析的增材方法, 发明专利, 申请号: 2024115183066, 申请日期: 2024年10月29日.

11. 何思亮, 胡靓颖, 黄家强, 李望云. 一种阻碍甲酸气氛下锡飘散的方法, 发明专利, 申请号: 2024114967061, 申请日期: 2024年10月25日.

12. 秦红波, 丁超, 李望云, 黄家强, 蔡苗, 杨道国, 张国旗. 一种焊点高度可调的线型焊点制备夹具, 实用新型专利, ZL202022373196.2, 公告号: CN 213560432 U, 申请日期: 2020年10月22日, 授权日: 2021年6月29日

13. 秦红波, 丁超, 刘天寒, 秦薇, 雷楚宜, 李望云, 蔡苗, 杨道国, 张国旗. 一种可调焊缝间隙的钎焊夹具, 实用新型专利, ZL202022373226.X, 公告号: CN 213560433 U, 申请日期: 2020年10月22日, 授权日: 2021年6月29日

14. 秦红波, 秦薇, 岳武, 李望云, 黄家强, 蔡苗, 杨道国, 张国旗. 一种方波脉冲发生器, 实用新型专利, ZL202023121076.X, 公告号: CN 214380590 U, 申请日期: 2020年12月22日, 授权日: 2021年10月8日

15. 秦红波, 秦薇, 岳武, 李望云, 黄家强, 蔡苗, 杨道国, 张国旗. 一种微焊点蠕变寿命测试装置, 实用新型专利, ZL202022338122.5, 公告号: CN 213580453 U, 申请日期: 2020年10月20日, 授权日: 2021年6月29日,

16. 秦红波, 雷楚宜, 黄家强, 李望云, 刘天寒, 丁超, 秦薇, 蔡苗, 杨道国, 张国旗. 一种微焊点电迁移测试结构及制备夹具, 实用新型专利, ZL202021857785.1, 公告号: CN 212812143 U, 申请日期: 2020年8月31日, 授权日: 2021年3月26日

17. 秦红波, 雷楚宜, 岳武, 丁超, 秦薇, 李望云, 黄家强, 蔡苗, 张国旗. 一种基于珀尔帖效应的微焊点热迁移装置, 实用新型专利, ZL202021857785.1, 公告号: CN 214472916 U, 申请日期: 2020年11月30日, 授权日: 2021年10月22日

18. 秦红波, 秦薇, 岳武, 李望云, 黄家强, 蔡苗, 杨道国, 张国旗. 一种微焊点力学性能测试装置, 实用新型专利, ZL202023119823.6, 公告号: CN 214668184 U, 申请日期: 2020年12月23日, 授权日: 2021年11月9日

19. 秦红波, 雷楚宜, 黄家强, 李望云, 刘天寒, 丁超, 秦薇, 蔡苗, 杨道国, 张国旗. 一种微焊点电迁移测试结构、制备夹具及制备方法, 发明专利, 专利申请号: 202010897260.9, 申请日期: 2020年8月31日

20. 秦红波, 秦薇, 岳武, 李望云, 黄家强, 蔡苗, 杨道国, 张国旗. 一种微焊点蠕变寿命测试装置及使用方法, 发明专利, 专利申请号: 202011123233.2, 申请日期: 2020年10月20日

21. 秦红波, 雷楚宜, 岳武, 丁超, 秦薇, 李望云, 黄家强, 蔡苗, 张国旗. 一种基于珀尔帖效应的微焊点热迁移装置及其测试方法, 发明专利, 申请号: 202011369727.9, 申请日: 2020年11月30日

22. 蔡苗, 王希有, 杨道国, 李望云, 张国旗. 插座和插头, 中国实用新型专利, ZL201921239613.5, 授权公告日: 2020年4月17日.

23. 蔡苗, 王希有, 杨道国, 李望云, 张国旗. 插座、插头和插座的控制方法, 中国发明专利, 申请号: 201910710142.X,  申请日: 2019年8月2日

24. 张新平, 李望云. 评价微焊点在电-热-力耦合场作用下可靠性的实验系统, 中国实用新型专利, ZL201520531908.5, 授权公告日: 2015年12月2日. (博士生导师一作)

25. 张新平, 李望云, 周敏波. 材料相变行为表征用电-热耦合处理系统, 中国实用新型专利, ZL201621152528.1, 授权公告日: 2017年6月6日 (博士生导师一作)

26. 张新平, 李望云, 周敏波. 采用电-热耦合场加载制备多形态微纳米二氧化锡的方法, 中国发明专利, ZL201610930996.5, 授权公告日: 2018年7月10日 (博士生导师一作)

27. 张新平, 李望云, 周敏波. 一种材料相变行为表征用电-热耦合处理系统, 中国发明专利, ZL201610938896.7, 申请日期: 2016年10月31日, 授权公告日: 2023年5月23日 (博士生导师一作)

28. 张新平, 曾才有, 李媛媛, 赵仲勋, 李望云. 一种形状记忆合金热循环稳定性及功能疲劳性能测试系统, 中国实用新型专利, ZL201720111860.1, 申请日期: 2017年2月28日, 授权公告日: 2017年10月17日

29. 张新平, 李媛媛, 马骁, 曹姗姗, 曾才有, 李望云. 基于电-热耦合场的形状记忆合金材料功能疲劳性能测试系统, 中国实用新型专利, ZL201621296018.1, 申请日期: 2016年10月30日, 授权公告日: 2017年6月20日

30. 张新平, 李媛媛, 马骁, 曹姗姗, 曾才有, 李望云. 电-热耦合场中的形状记忆合金材料疲劳性能测试系统, 中国发明专利, 申请号: 201611088408.4

31. 张新平, 曾才有, 李媛媛, 赵仲勋, 李望云. 形状记忆合金热循环稳定性及功能疲劳性能测试系统, 中国发明专利, 申请号: 201710068496.X

学术奖励

1. 广西机械工程学会科学技术奖, 三等奖(1/12), 近服役条件下高可靠性优化设计导向的电子制造业用锡基钎料研发与应用, 李望云, 秦红波, 林成旭, 王莉莉, 黄家强, 梁才航, 钟思, 农永萍, 徐灿辉, 覃伟明, 谭宗勇, 唐祥俊, 2024年11月12日

2. 2021年第22届电子封装技术国际会议(ICEPT)最佳学生论文奖/Best Student Paper Award; X.L. Wei, D.G. Yang*, W.Y. Li, X.Y. Wang, G.S. Lu, S.R. Xue, Research on thermal characteristics of high power 3D microchannel multichip package, 22th International Conference on Electronic Packaging Technology, Xiamen, China, 14-17 Sep, 2021. DOI: 10.1109/ICEPT52650.2021.9568240 (证书获奖日期: 2021年9月15日)

3. 2020年第21届电子封装技术国际会议(ICEPT)最佳学生论文奖/ICEPT Best Student Paper Award (2^nd place); W. Qin, Y.K. Li, T.F. Kuang, C. Ding, C.Y. Lei, W.Y. Li, H.B. Qin*, Research on the anisotropic mechanical behavior of microscale Sn58Bi solder matrix via finite element simulation, 21th International Conference on Electronic Packaging Technology, Guangzhou, China, 11-15 Aug, 2020. DOI: 10.1109/ICEPT50128.2020.9202950 (证书获奖日期: 2020年8月13日)

4. 2017年第18届电子封装技术国际会议(ICEPT)杰出论文奖/Outstanding Paper Award; W.Y. Li, M.B. Zhou, X.P. Zhang*, Abnormal creep behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu joints with different joint thicknesses under electro-thermo-mechanical coupled loads, 18th International Conference on Electronic Packaging Technology, Harbin, China, 16-19 Aug, 2017. DOI: 10.1109/ICEPT.2017.8046751 (证书获奖日期: 2017年8月17日)

5. 2015年第16届电子封装技术国际会议(ICEPT)最佳学生论文奖/Cisco & ASE Best Student Paper Award，获奖金200美元; W.Y. Li, M.B. Zhou, X.P. Zhang*, Creep behavior of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under tensile stress coupled with DC current stressing, 16th International Conference on Electronic Packaging Technology, Changsha, China, 11-14 Aug, 2015, 187-192. (证书获奖日期: 2015年8月12日，获奖金200美元)

期刊论文审稿人（国际期刊）

1. Scientific Reports

2. Applied Physics Letters

3. Journal of Applied Physics

4. Materials Characterization

5. Journal of Materials Science

6. Journal of Materials Research

7. Journal of Molecular Modeling

8. Journal of Alloys and Compounds

9. Soldering & Surface Mount Technology

10. Journal of Materials Research and Technology

11. Journal of Materials Science: Materials in Electronics

专著审稿人

12. Bentham Science Publisher

荣誉称号

1. 基于“1+6+X”产教融合育人模式的电子封装技术专业培养体系建设与实践, 二等奖 (8/10), 首届“科德杯”中国机械行业产教融合教育教学创新大赛（区域赛）, 2024年10月

2. 校优秀硕士学位论文研究生指导教师, 2024年6月

3. 校优秀硕士学位论文研究生指导教师, 2023年6月

4. 校“本科课堂教学质量优秀奖”——“优秀课堂质量奖”二等奖, 2023年3月

5. 校“本科课堂教学质量优秀奖”——“课程思政标杆课程”一等奖, 2023年3月

6. 校第二届优秀研究生导师团队, 4/8, 2022年11月

7. 校优秀硕士学位论文研究生指导老师, 2022年7月

8. 校课程思政示范课程、教学名师和团队, 2022年6月

9. 校级优秀本科毕业设计（论文）三等奖, 2022年5月

10. “本科课堂教学质量优秀奖”——“创新教学奖”一等奖, 2021年12月

11. 校第二届教师板书设计比赛二等奖, 2021年11月

12. 校第二届优秀教学课件评选优秀奖, 2021年11月

13. 桂林电子科技大学机电工程学院纪念建党100周年“优秀共产党员”荣誉称号, 2021年5月

14. 校首届教师板书设计比赛优秀奖, 2021年1月

15. 机电工程学院“我最喜爱的老师”称号, 2020年12月

16. 校级课程思政示范课讲课比赛二等奖, 2020年12月

17. “本科课堂教学质量优秀奖”二等奖, 2020年12月

18. “本科课堂教学质量优秀奖”二等奖, 2019年12月