学术论文
2024年 Guanda Qu, Wei Guo, Cheng Zhang, Junliang Xue, Zilong Peng, Changhao Yin, Siliang He*, Guisheng Zou, Qiang Jia, Hongqiang Zhang*，“Improving thermal stability and reliability of power chips by sintering foam structure layer”，Applied Materials Today, vol. 40, pp. 102397, 2024(SCI, 中科院二区) Wangyun Li, Lanqing Mo, Feng Chen, Zongbei Dai, Yiqin Xu, Siliang He*, Hiroshi Nishikawa*, “Counter-intuitive mechanical performance variation in aged low-temperature interconnections in electronic packaging”, Vaccum, vol. 227, pp. 113367, 2024(SCI, 中科院二区) Zhang Hongqiang, He Siliang*, Qu Guanda, Deng Zhongyang, Zou Guisheng, Jia Qiang*, Deng Erping*, Guo Wei, “Improved thermal conductivity and reliability through graphene reinforced nanopaste for power devices in new energy vehicles”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 1, pp. 52-60, 2024（SCI, ） Xiong Bifu, He Siliang*, Ge Jinguo, Li Quantong, Hu Chuan, Yan Haidong, Shen Yu-An*, “Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere”, Soldering & Surface Mount Technology, Vol. 36 No. 1, pp. 39-50, 2024(SCI, 中科院二区) Siliang He, Jian Jiang, Yu-An Shen, Lanqing Mo, Yuhao Bi, Junke Wu, Chan Guo*, “Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature”, Materials, 2024(SCI,)
2023年 Li Wangyun*, Mo Lanqing, Li Xingmin, Wang Jian, Qin Hongbo, He Siliang*,“Minor Ag induced shear performance alternation in BGA structure Cu/SnBi/Cu solder joints under electric current stressing”,Journal of Materials Research and Technology, Vol. 25, pp. 6111-6122, 2023(SCI, 中科院一区TOP) He, Siliang; Xiong, Bifu; Xu, Fangyi; Chen, Biyang; Cui, Yinhua; Hu, Chuan; Yue, Gao*; Shen, Yu-An*, “Low-Temperature Transient Liquid Phase Bonding Technology via CuPorous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere”，Materials, 2023(SCI,)
2022年 He Siliang*, Shen Yu-An, Xiong Bifu, Huo Fupeng, Li Jiahui, Ge Jinguo, Pan Zhiliang, Li Wangyun, Hu Chuan, Nishikawa Hiroshi, “Behavior of Sn-3.0Ag-0.5Cusolder/Cu fluxless soldering via Sn steaming under formic acid atmosphere”,Journal of Materials Research and Technology, Vol. 21, pp. 2352-2361, 2022(SCI, 中科院一区TOP) Siliang He*, Yuhao Bi, Yu-An Shen, Zhikuan Chen, Gao Yue*, Chuan Hu, and Hiroshi Nishikawa. Contact Angle Analysis and Intermetallic Compounds Formation Between Solders and Substrates under Formic acid Atmosphere. Journal of Advanced Joining Process.（2022）, 6, 100118.（ESCI,） Peijie Liang, Zhiliang Pan, Liang Tang, Guoqi Zhang, Daoguo Yang, Siliang He*, and Haidong Yan*. Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer. Materials.2022, 15, 2232.（SCI） Minghui Yun, Daoguo Yang*, Siliang He*, Miao Cai, Jing Xiao, Kailin Zhang and Guo- Qi Zhang. Failure Quantitative Assessment Approach to MOSFET Power Device by Detecting Parasitic Parameters. Frontiers in Physics. 2022. (SCI)
2022年以前发表期刊论文 He, S.*, Gao, R., Shen, Y-A., Li, J. and Nishikawa., H. “Wettability, Interfacial reactions, and Impact Strength of Sn-3.0Ag-0.5Cu Solder/ENIG Substrate Used for Fluxless Soldering under Formic Acid Atmosphere”,Journal of Materials Science, vol. 57 No. 7, pp. 3107-3117, 2020(SCI, 中科院二区TOP) He, S.*, Gao, R., Li, J., Shen, Y-A. and Nishikawa, H., “In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere”,Materials chemistry and Physics, vol. 239, pp. 122309, 2020(SCI,) Gong, Y., Liu, L., He, S., Yan, H., Li, W.*, Qin, H.* Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density. J Mater Sci: Mater Electron (2022). Online. (SCI,) Xinmin Li, Jian Wang, Hongbo Qin, Siliang He, Wangyun Li*, and Song Wei*. Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density. Journal of Materials Science: Materials in Electronics 33, 16167–16182 (2022) (SCI) Juncai Hou*; Qiumei Zhang; Siliang He; Jingru Bian; Jinting Jiu; Chengxin Li; Hiroshi Nishikawa., Large-area and low-cost Cu-Cu bonding with cold-spray-deposition, oxidation and reduction processes under low-temperature conditions. Journal of Materials Science: Materials in Electronics 32 (2021), pp.20461–20473（SCI） Duy Le Han*, Yu-An Shen, Siliang He, Hiroshi Nishikawa., Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy. Materials Science and Engineering: A 804 (2021), pp.140785（SCI） Fupeng Huo*, Yu-An Shen, Siliang He, Keke Zhang, Hiroshi Nishikawa., Fabrication of NiO/ZrO2 nanocomposites using ball milling-pyrolysis method. Vacuum 191 (2021), pp.110370（SCI） Gao, R.*, He, S., Li, J., Shen, Y-A. and Nishikawa, H., Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding. Journal of Materials Science: Materials in Electronics 31 (2020), pp.14635–14644.（SCI） Gao, R.*, Shen, Y-A., Li, J., He, S. and Nishikawa, H., Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding. Journal of Materials Science: Materials in Electronics 31 (2020),pp.21711-21722（SCI） Zhou, S.*, He, S. and Nishikawa, H., Effect of Zn addition on interfacial reactions and mechanical properties between eutectic Sn58Bi solder and ENIG substrate. Journal of Nanoscience and Nanotechnology, 20 (1), (2020), pp.106-112.（SCI） Jin, Z.*, Shen, Y-A., He, S., Zhou, S., Chan, Y, C. and Nishikawa, H. Novel Polarity Effect on Intermetallic Compound Thickness Changes during Electromigration in Cu/Sn- 3.0Ag - 0.5Cu/Cu Solder Joints. Journal of Applied Physics 126, (2019), 185109.（SCI） Shen, Y-A.*, Lin, C.M., Li, J., He, S. and Nishikawa, H., 2019. Effect of FeCoNiCrCu 0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0 Ag-0.5 Cu Solder. Scientific Reports 9(1) (2019), pp.3658.（SCI） Gao, R.*, He, S., Shen, Y-A and Nishikawa, H., Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles. Journal of Electronic Materials 48(4) (2019), pp.2263-2271.（SCI） He, S. and Nishikawa, H.*, Effect of Thermal Aging on the Impact Strength of Soldered Bumps under Formic acid Atmosphere. Quarterly Journal of The Japan Welding Society 35 (2017), pp.127-131.（EI） Liu, X.*, He, S. and Nishikawa, H., Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach. Journal of Alloys and Compounds 695 (2017), pp.2165-2172.（SCI） Liu, X.*, He, S. and Nishikawa, H., Thermally stable Cu3Sn/Cu composite joint for high-temperature power device. Scripta Materialia, 110, (2016), pp.101-104.（SCI）
知识产权
[1] 何思亮; 凌云志; 崔银花; 郑伟; 胡川; 陈志涛，一种甲酸气氛下纳米结构凸点键合方法，发明专利 [2] Yunzhi Ling; Siliang He; Jianguo Ma; Yuhao Bi; Xingyu Liu; Chuan Hu; Zhitao Chen; Substrate Bonding Method，美国专利
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