[1] 广西自然科学基金面上项目，2024GXNSFAA010365，熔融状态BGA结构Sn-Bi微焊点在电-热作用下的组织演化及失效机理研究，2024/1至2026/12，10万元，主持

[2] 广西自然科学基金面上项目，2019JJA160170，BGA结构多界面混装焊点在电-热-力多场耦合下的疲劳行为研究，2020/1至2022/1，10万元，主持

[3] 广西科技基地和人才专项项目，2019AC20132，低成本高性能Sn-Bi无铅锡膏的制备与性能研究，2019/12至2022/11，10万元，主持

[4] 广西制造系统与先进制造技术重点实验室主任课题项目，23354S005，电子互连低熔点微焊点的液-固电迁移行为研究，2024/1至2025/12，2万元，主持

[5] 深圳市战略性新兴产业发展专项资金项目, 电子封装低温钎焊用无卤素高韧性Sn-Bi环保锡膏的研发,198万元，2021/1至2022/12，主持

[6] 深圳市战略性新兴产业发展专项资金项目, 用于芯片封装的无卤素低空洞Sn-Ag-Cu无铅锡膏的研制,2022/1/1至2023/12/31，237万元，主持

[7] 广西高校中青年教师科研基础能力提升项目，2019KY0221，不含卤素低成本高性能锡铋低温锡膏的研究，2019/1至2020/12，2万元，主持

[8] 广西科技重大专项，GUIKEAA24206068，先进封装用强键合无铅焊球的关键技术与开发应用，2024-2027，参与

[9] 国家自然科学基金地区项目，52065015，电子封装非均质各向异性微焊点微观力学行为及失效机理研究，2021/01至2024/12，参与

（*为通讯作者）

[1] Jiaqiang Huang, Zhiling Ning, Caiping Yu, Dongjing Liu, Yujie Liu, Dawei Xiao, Development of high‑performance Cu nanoparticle paste and low‑temperature sintering for Cu–Cu bonding, Journal of Materials Science: Materials in Electronics, 2025, 36: 529. (SCI)

[2] Jiaqiang Huang, Yunhui Zhu, Kunhong Pan, Xudong Wang, Zhaoling Huang, Dawei Xiao, Hongjie Jiang, Polarity effect of interfacial intermetallic compounds of BGA structure Cu/Sn-52In/Cu solder joints during electromigration, Intermetallics, 2024, 168: 108252. (SCI)

[3] 刘东静, 周福, 胡志亮, 黄家强*. 石墨烯/GaN 异质结构界面热输运性质的分子动力学研究[J].物理学报,2024,73,13:137901. (SCI)

[4] Jiaqiang Huang, Yunhui Zhu, Xudong Wang, Zhaoling Huang, Fengmei Liu, Yupeng Zhang, Melting Characteristic, Wettability, Interfacial Reaction and Shear Property of Ball Grid Array Structure Cu/Sn0.3Ag0.7Cu/Cu Solder Joints with Ni-Modified Carbon Nanotubes, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, 13, 8: 1174-1186.  (SCI)

[5] Zhaoling Huang, Siyuan Li, Hao Guo, Caiping Huang, Yuyu Bian, Yubing Gong, Jiaqiang Huang*, Qi Zeng*, Multi-scale GO/CNT/AlN nanocomposites for high-performance flexible electrothermal film heaters, Journal of Materials Chemistry C, 2023, 11, 9925-9936. (SCI)

[6] Wangyun Li*, Feng Chen, Jun Gui, Siliang He, Hongbo Qin, Jiaqiang Huang*, Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints at low temperatures, Microelectronics Reliability, 2023, 150: 115093. (SCI)

[7] Shuibao Liang, Han Jiang, Jiaqiang Huang, Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing, Journal of Electronic Materials, 2023, 53(3): 1192-1200. (SCI)

[8] Jiaqiang Huang, Xudong Wang, Junyu Chen, Weichun Wei, Fengmei Liu, Binhao Qin, Haiyan Wang, Yupeng Zhang, Growth mechanisms of intermetallic compounds and Bi-rich layer in ball grid array structure Cu/Sn-58Bi/Cu solder joints during solid-solid and liquid-solid electromigration, Journal of Materials Science: Materials in Electronics, 2022, 33:10297-10313. (SCI)

[9] Yunhui Zhu, Lifang Wang, Xudong Wang, Siliang He, Jiaqiang Huang*, Preparation and performance evaluation of Sn-Bi solder paste. The International Conference on Electronic Packaging Technology (ICEPT), 2022. (EI)

[10] Shuibao Liang, Changbo Ke, Jiaqiang Huang, Minbo Zhou, Xinping Zhang, Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient, Microelectronics Reliability, 2019, 92: 1-11. (SCI)

[11] Huang Jiaqiang, Zhou Minbo, Liang Shuibao, Zhang Xinping, Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3.0Ag0.5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing temperature, Journal of Materials Science: Materials in Electronics, 2018, 29(9): 7651-7660. (SCI)

[12] Jiaqiang Huang, Minbo Zhou, Xinping Zhang, The melting characteristics and interfacial reactions of Sn-ball/Sn–3.0Ag–0.5Cu-paste/Cu joints during reflow soldering, Journal of Electronic Materials, 2017, 46(3): 1504-1515. (SCI)

[13] Yunhui Zhu, Lifang Wang, Xudong Wang, Siliang He, Jiaqiang Huang*, Preparation and performance evaluation of Sn-Bi solder paste, The International Conference on Electronic Packaging Technology (ICEPT), 2022. (EI)

[14] Jiaqiang Huang, Minbo Zhou, Xinping Zhang, Effect of electromigration on the interfacial reaction and shear fracture behavior of mixed assembly Cu/Sn–3.0Ag–0.5Cu-ball/Sn–58Bi-paste/Cu joints in board-level packaging, The International Conference on Electronic Packaging Technology (ICEPT), 2018: 531-535. (EI)

[15] Jiaqiang Huang, Minbo Zhou, Xingfei Zhao, Xinping Zhang, Microstructures and shear properties of mixed assembly BGA structure SnAgCu/SnBi(Ag)/Cu joints in board-level packaging, The International Conference on Electronic Packaging Technology (ICEPT), 2017, 1649-1654. (EI)

[16] Jiaqiang Huang, Minbo Zhou, Wangyun Li, Xinping Zhang, Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-balll/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on BGA packaging, The International Conference on Electronic Packaging Technology (ICEPT), 2016, 1010-1014. (EI)

[17] Jiaqiang Huang, Minbo Zhou, Xinping Zhang, Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging, The International Conference on Electronic Packaging Technology (ICEPT), 2016, 968-973. (EI)

[18] Jiaqiang Huang, Minbo Zhou, Wangyun Li, Xinping Zhang, Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn–3.0Ag–0.5Cu-paste/Cu joints in flip-chip on BGA packaging, The International Conference on Electronic Packaging Technology (ICEPT), 2015, 307-311. (EI)

[19] Jiaqiang Huang, Minbo Zhou, Changzheng Li, Xiao Ma, Xinping Zhang, Processing Performance and Microstructure of Sn-Zn Based Solders Modified by Bi and Mixed Rare Earth Elements, The International Conference on Electronic Packaging Technology (ICEPT), 2012, 352-355. (EI)

[1] 黄家强, 肖大为, 肖涵飞, 肖健, 肖雪, 余海涛, 肖东明, 刘家党, 电子封装用SnBi系无铅焊料及其制备方法,2024-11-04, 发明专利, CN202411559311.1

[2] 黄家强, 朱耘辉, 黄兆岭, 张宇鹏, 刘凤美, 高海涛, 李琪. 一种增强相改性的低银无铅复合锡膏及其制备方法与应用, 2023-11-1, 发明专利, CN2023114418680

[3] 黄家强, 王旭东, 李望云, 秦红波, 位松, 杨道国, 一种微焊点电迁移测试系统和方法, 2023-4-13, 发明专利, CN202310394674.3

[4] 黄家强, 刘家党, 刘玉洁, 卢克胜, 肖大为, 肖涵飞, 肖健, 肖雪, 肖东明, 肖东明, 一种焊锡膏回温存放装置, 2023-1-9, 实用新型专利，ZL202320050537.3

[5] 黄家强, 王旭东, 陈俊宇, 韦伟春, 李望云, 秦红波, 何思亮, 杨道国, 一种原位观察微焊点微观组织演化的方法, 2021-11-24, 发明专利, CN202111408769.3

[6] 黄家强, 肖德成, 刘家党, 景龙, 一种电子封装软钎焊用系列低银无铅钎料及其制备方法, 2013-4-27, 发明专利, ZL201310152250.2

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